Low dielectric materials for communication equipment Smart Cellular Board
Achieved further reduction in dielectric constant of engineering plastics and super engineering plastics with unique foaming technology. Contributed to solving design challenges arising from multi-band and high-frequency applications.
The Smart Cellular Board (SCB) from Furukawa Electric is a low dielectric material in a finely foamed sheet form. Our proprietary foaming technology allows us to foam resins that are highly heat-resistant and difficult to foam, such as engineering plastics and super engineering plastics. As a result, we can fill air into various inherently low dielectric resins, reducing their dielectric properties to levels that are difficult to achieve with conventional resin materials. In particular, the low dielectric constant (Dk) achieves a value below 2.0, which is challenging with solid resins. If you are facing challenges in designing communication devices for high frequency and multi-band applications, please consider our product. 【SCB Features for Substrate Applications】 - Reduction of transmission loss due to low Dk and low Df - Compatibility of low height and low transmission loss due to low Dk - Suppression of miniaturization of array antennas associated with high frequency 【SCB Features for Radome Applications】 - Suppression of radio wave reflection due to low Dk - Assurance of radio wave transparency over a wide bandwidth and wide angle without worrying about radome thickness - Suppression of reflection and interference of radio waves within the antenna - Lightweight radome design
- Company：古河電気工業 機能樹脂エンジニアリング営業部
- Price：Other
